Qualcomm, Inc. Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
En bref
- Source
- NVD
- EPSS
- EPSS 0.13 % · centile 2 ()
- État
- PUBLISHED
- Publiée
- Mise à jour
- Attribuée par
- qualcomm
- Statut NVD
- Modified
Rechercher sur…
Description
Due to insufficient validation of ELF headers, an Incorrect Calculation of Buffer Size can occur in Boot leading to memory corruption in Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Faiblesses (CWE)
- CWE-131 — Calcul incorrect de la taille d'un tampon
Références
Scores
| Version | Score | Vecteur | Évalué par |
|---|---|---|---|
| CVSS 3.1 | HIGH 8.4 | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | qualcomm |
| CVSS 3.1 | HIGH 8.4 | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | NVD · product-security@qualcomm.com (Secondary) |
| CVSS 3.1 | HIGH 8.4 | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
Références européennes
- ENISA EUVD · EUVD-2021-21778
- GCVE · GCVE-0-2021-35134
Avis du CERT-FR
- CERTFR-2023-AVI-0003 — Multiples vulnérabilités dans les produits Android · cert.ssi.gouv.fr
Configurations affectées (CPE NVD)
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qsm8350_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd778g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd780g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd888_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd888_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7315_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7325p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7450_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8475_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8475p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6740_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6750_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6850_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6851_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6855_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6856_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn7850_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn7851_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8832_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
Produits affectés
| Produit | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | affected QCA6391, QCM6490, QCS6490, QSM8350, SD 8 Gen1 5G, SD778G, SD780G, SD888, SD888 5G, SM7315, SM7325P, SM7450, SM8475, SM8475P, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN6740, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WCN7850, WCN7851, WSA8830, WSA8832, WSA8835 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |