Qualcomm, Inc. Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
At a glance
- Source
- NVD
- EPSS
- EPSS 0.13 % · percentile 2 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
Due to insufficient validation of ELF headers, an Incorrect Calculation of Buffer Size can occur in Boot leading to memory corruption in Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Weaknesses (CWE)
- CWE-131 — Incorrect Calculation of Buffer Size
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.1 | HIGH 8.4 | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | qualcomm |
| CVSS 3.1 | HIGH 8.4 | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | NVD · product-security@qualcomm.com (Secondary) |
| CVSS 3.1 | HIGH 8.4 | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2021-21778
- GCVE · GCVE-0-2021-35134
CERT-FR advisories
- CERTFR-2023-AVI-0003 — Multiples vulnérabilités dans les produits Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qsm8350_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd778g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd780g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd888_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd888_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7315_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7325p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7450_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8475_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8475p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6740_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6750_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6850_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6851_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6855_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6856_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn7850_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn7851_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8832_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | affected QCA6391, QCM6490, QCS6490, QSM8350, SD 8 Gen1 5G, SD778G, SD780G, SD888, SD888 5G, SM7315, SM7325P, SM7450, SM8475, SM8475P, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN6740, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WCN7850, WCN7851, WSA8830, WSA8832, WSA8835 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |