Qualcomm Technologies, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
6 vulnérabilités publiées citent ce produit.
Tel que les CNA l’écrivent dans leurs fiches CVE (éditeur et produit) ; les versions sont les leurs.
| CVE | Versions vulnérables | Titre | Sévérité | Publiée | EPSS | Exploitation |
|---|---|---|---|---|---|---|
| CVE-2017-18278 | MDM9206 ; MDM9607 ; MDM9650 ; … | An integer underflow may occur due to lack of check when received data length from font_mgr_qsee_request_service is bigger than the minimal | HIGH 7.8 | 0.2 % | ||
| CVE-2017-18275 | MDM9206 ; MDM9607 ; MDM9650 ; … | A new account can be inserted into simContacts service using Android command line tool in Snapdragon Automobile, Snapdragon Mobile, Snapdrag | MEDIUM 5.5 | 0.2 % | ||
| CVE-2017-18274 | MDM9206 ; MDM9607 ; MDM9650 ; … | While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models | HIGH 7.8 | 0.2 % | ||
| CVE-2017-18157 | MDM9206 ; MDM9607 ; MDM9650 ; … | A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM | HIGH 7.8 | 0.2 % | ||
| CVE-2017-18156 | MDM9206 ; MDM9607 ; MDM9650 ; … | While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdrag | HIGH 7.8 | 0.2 % | ||
| CVE-2017-18131 | MDM9206 ; MDM9607 ; MSM8996AU ; … | In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8 | HIGH 7.8 | 0.2 % |