Stack-based Buffer Overflow in Windows Compute (Qualcomm, Inc. Snapdragon)
En bref
- Source
- NVD
- EPSS
- EPSS 0.08 % · centile 0 ()
- État
- PUBLISHED
- Publiée
- Mise à jour
- Attribuée par
- qualcomm
- Statut NVD
- Analyzed
Description
Memory Corruption when output buffer size is smaller than input buffer size during data copying operation.
Faiblesses (CWE)
- CWE-121 — Débordement de tampon sur la pile
Références
Scores
| Version | Score | Vecteur | Évalué par |
|---|---|---|---|
| CVSS 3.1 | MEDIUM 6.7 | CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H | qualcomm |
| CVSS 3.1 | MEDIUM 6.7 | CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H | NVD · product-security@qualcomm.com (Secondary) |
Références européennes
- ENISA EUVD · EUVD-2025-210026
- GCVE · GCVE-0-2025-59613
Configurations affectées (CPE NVD)
cpe:2.3:o:qualcomm:cologne_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:iqx5121_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:iqx7181_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca0000_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm5430_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sc8380xp_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_460_mobile_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_662_mobile_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_7c\+_gen_3_compute_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_8cx_gen_3_compute_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_ar1_gen_1_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_xr2_5g_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_xr2\+_gen_1_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sxr2230p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sxr2250p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9378c_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8832_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8840_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8845h_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:x2000077_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:x2000086_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:x2000090_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:x2000092_firmware:-:*:*:*:*:*:*:*- +4 autres
Produits affectés
| Produit | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon | affected Cologne ; affected FastConnect 6700 ; affected FastConnect 6900 ; affected FastConnect 7800 ; affected QCA0000 ; affected QCM5430 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |