Time-of-check Time-of-use (TOCTOU) Race Condition in DSP Service (Qualcomm, Inc. Snapdragon)
At a glance
- Source
- NVD
- EPSS
- EPSS 0.05 % · percentile 0 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Analyzed
Description
Memory corruption while creating a process on the digital signal processor due to allocation failure at the kernel level.
Weaknesses (CWE)
- CWE-367 — Time-of-check Time-of-use (TOCTOU) Race Condition
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | qualcomm |
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · product-security@qualcomm.com (Secondary) |
| CVSS 3.1 | HIGH 7.0 | CVSS:3.1/AV:L/AC:H/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2025-209632
- GCVE · GCVE-0-2025-47407
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:video_collaboration_vc1_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qxm1083_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qxm1086_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qxm1093_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qxm1094_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qxm1095_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qxm1096_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sar1165p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sar2130p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sc8380xp_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd662_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6225p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6450p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6475p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6475q_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6850_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7435_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7435p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7635p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8735p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8750p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8845p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_4_gen_2_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_460_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_6_gen_1_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_6_gen_3_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_662_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_680_4g_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_685_4g_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_7_gen_4_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_8_elite_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qpa1086bd_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qpa1083bd_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qmp2001_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qmp1000_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qmb715_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qln1086bd_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qln1083bd_firmware:-:*:*:*:*:*:*:*- +60 more
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon | affected CQ7790 ; affected CQ8725S ; affected FastConnect 6200 ; affected FastConnect 6700 ; affected FastConnect 6900 ; affected FastConnect 7800 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |