Buffer Over-read in DSP Service (Qualcomm, Inc. Snapdragon)
At a glance
- Source
- NVD
- EPSS
- EPSS 0.07 % · percentile 0 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Analyzed
Description
Information Disclosure while processing IOCTL handler callbacks without verifying buffer size.
Weaknesses (CWE)
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.1 | MEDIUM 6.1 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:L | qualcomm |
| CVSS 3.1 | MEDIUM 6.1 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:L | NVD · product-security@qualcomm.com (Secondary) |
| CVSS 3.1 | MEDIUM 5.5 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2025-209631
- GCVE · GCVE-0-2025-47406
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:x2000086_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:x2000090_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:x2000092_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:x2000094_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:xg101002_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:xg101032_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:xg101039_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:x2000077_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8845h_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8840_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9378c_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_8cx_gen_3_compute_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_7c\+_gen_3_compute_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sc8380xp_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm5430_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca0000_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:iqx7181_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:iqx5121_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:cologne_firmware:-:*:*:*:*:*:*:*
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon | affected Cologne ; affected FastConnect 6700 ; affected FastConnect 6900 ; affected FastConnect 7800 ; affected IQX5121 ; affected IQX7181 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |