Buffer Copy Without Checking Size of Input in Automotive Platform (Qualcomm, Inc. Snapdragon)
En bref
- Source
- NVD
- EPSS
- EPSS 0.10 % · centile 1 ()
- État
- PUBLISHED
- Publiée
- Mise à jour
- Attribuée par
- qualcomm
- Statut NVD
- Analyzed
Rechercher sur…
Description
Memory corruption when buffer copy operation fails due to integer overflow during attestation report generation.
Faiblesses (CWE)
- CWE-120 — Copie de tampon sans vérification de taille (débordement classique)
Références
Scores
| Version | Score | Vecteur | Évalué par |
|---|---|---|---|
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | qualcomm |
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · product-security@qualcomm.com (Secondary) |
Références européennes
- ENISA EUVD · EUVD-2025-209224
- GCVE · GCVE-0-2025-47389
Configurations affectées (CPE NVD)
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:cologne_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:csra6620_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:csra6640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6200_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_x35_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_x53_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_x55_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_x72_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_x75_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_xr2\+_gen_1_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_xr2_5g_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:srv1h_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:srv1l_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:srv1m_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sw6100_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sw6100p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sxr2330p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sxr2350p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:themisto_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:video_collaboration_vc1_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9335_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9340_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9378_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9378c_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9390_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9395_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3910_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6450_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6755_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn7860_firmware:-:*:*:*:*:*:*:*- +141 autres
Produits affectés
| Produit | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon | affected AR8035 ; affected Cologne ; affected CSRA6620 ; affected CSRA6640 ; affected FastConnect 6200 ; affected FastConnect 6700 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |