Buffer Copy without Checking Size of Input in DSP Service (Qualcomm, Inc. Snapdragon)
En bref
- Source
- NVD
- EPSS
- EPSS 0.08 % · centile 0 ()
- État
- PUBLISHED
- Publiée
- Mise à jour
- Attribuée par
- qualcomm
- Statut NVD
- Analyzed
Rechercher sur…
Description
Memory corruption while passing pages to DSP with an unaligned starting address.
Faiblesses (CWE)
- CWE-120 — Copie de tampon sans vérification de taille (débordement classique)
Références
Scores
| Version | Score | Vecteur | Évalué par |
|---|---|---|---|
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | qualcomm |
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · product-security@qualcomm.com (Secondary) |
Références européennes
- ENISA EUVD · EUVD-2026-1263
- GCVE · GCVE-0-2025-47388
Avis du CERT-FR
- CERTFR-2026-AVI-0231 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Configurations affectées (CPE NVD)
cpe:2.3:o:qualcomm:fastconnect_6200_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qmp1000_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:video_collaboration_vc1_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sg6150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sg6150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6475_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7435_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8735_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8750_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8750p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_4_gen_2_mobile_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_6_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_w5\+_gen_1_wearable_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sw5100_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sw5100p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sxr2330p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sxr2350p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9378_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9395_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6755_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn7750_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn7860_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn7861_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn7880_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn7881_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*- +5 autres
Produits affectés
| Produit | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon | affected FastConnect 6200 ; affected FastConnect 6700 ; affected FastConnect 6900 ; affected FastConnect 7800 ; affected QCS610 ; affected QMP1000 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |