Use After Free in DSP Service (Qualcomm, Inc. Snapdragon)
At a glance
- Source
- NVD
- EPSS
- EPSS 0.67 % · percentile 52 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Analyzed
Description
Memory corruption while maintaining memory maps of HLOS memory.
Weaknesses (CWE)
- CWE-416 — Use After Free
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | qualcomm |
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · product-security@qualcomm.com (Secondary) |
European references
- ENISA EUVD · EUVD-2024-40024
- GCVE · GCVE-0-2024-43047
CERT-FR advisories
- CERTFR-2024-AVI-0944 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6800_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qam8295p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6584au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6595_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6688aq_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:video_collaboration_vc1_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa4150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa4155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8295p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sg4150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_660_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_680_4g_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_685_4g_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_8_gen_1_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_865_5g_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_865\+_5g_mobile_firmware:-:*:*:*:*:*:*:*- +24 more
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon | affected FastConnect 6700 ; affected FastConnect 6800 ; affected FastConnect 6900 ; affected FastConnect 7800 ; affected QAM8295P ; affected QCA6174A |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| CISA Known Exploited Vulnerabilities | CC0 1.0 |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |