Integer Overflow or Wraparound in Graphics (Qualcomm, Inc. Snapdragon)
En bref
- Source
- NVD
- EPSS
- EPSS 0.13 % · centile 3 ()
- État
- PUBLISHED
- Publiée
- Mise à jour
- Attribuée par
- qualcomm
- Statut NVD
- Modified
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Description
Memory corruption while invoking IOCTL call for GPU memory allocation and size param is greater than expected size.
Faiblesses (CWE)
- CWE-190 — Débordement d'entier
Références
Scores
| Version | Score | Vecteur | Évalué par |
|---|---|---|---|
| CVSS 3.1 | HIGH 8.4 | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | qualcomm |
| CVSS 3.1 | HIGH 8.4 | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | NVD · product-security@qualcomm.com (Secondary) |
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
Références européennes
- ENISA EUVD · EUVD-2024-20876
- GCVE · GCVE-0-2024-23372
Avis du CERT-FR
- CERTFR-2024-AVI-0536 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Configurations affectées (CPE NVD)
cpe:2.3:o:qualcomm:fastconnect_6200_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:flight_rb5_5g_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qam8255p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qam8295p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qam8620p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qam8650p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qam8775p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qamsrv1h_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qamsrv1m_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6595_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6678aq_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6797aq_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm4325_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm4490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm5430_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm6125_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm8550_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs4490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs5430_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs6125_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs7230_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs8250_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs8550_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qrb5165n_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:video_collaboration_vc1_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:video_collaboration_vc5_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:robotics_rb5_platform_firmware:-:*:*:*:*:*:*:*- +71 autres
Produits affectés
| Produit | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon | affected FastConnect 6200 ; affected FastConnect 6700 ; affected FastConnect 6900 ; affected FastConnect 7800 ; affected Flight RB5 5G Platform ; affected QAM8255P |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |