Improper Release of Memory Before Removing Last Reference in Multi-Mode Call Processor (Qualcomm, Inc. Snapdragon)
At a glance
- Source
- NVD
- EPSS
- EPSS 0.32 % · percentile 26 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage.
Weaknesses (CWE)
- CWE-401 — Missing Release of Memory after Effective Lifetime
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.1 | HIGH 7.5 | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H | qualcomm |
| CVSS 3.1 | HIGH 7.5 | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H | NVD · product-security@qualcomm.com (Secondary) |
European references
- ENISA EUVD · EUVD-2023-37238
- GCVE · GCVE-0-2023-33049
CERT-FR advisories
- CERTFR-2024-AVI-0101 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:315_5g_iot_modem_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6200_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6800_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6421_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6431_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6584au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcc710_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm4490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm8550_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcn6024_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcn6224_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcn6274_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcn9024_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs4490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs8550_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qep8111_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qfw7114_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qfw7124_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd855_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd888_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx57m_firmware:-:*:*:*:*:*:*:*- +61 more
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon | affected 315 5G IoT Modem ; affected AR8035 ; affected FastConnect 6200 ; affected FastConnect 6700 ; affected FastConnect 6800 ; affected FastConnect 6900 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |