Signed-to-unsigned conversion error in Audio (Qualcomm, Inc. Snapdragon)
At a glance
- Source
- NVD
- EPSS
- EPSS 0.12 % · percentile 2 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
Memory corruption while parsing the ADSP response command.
Weaknesses (CWE)
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | qualcomm |
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · product-security@qualcomm.com (Secondary) |
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2023-37223
- GCVE · GCVE-0-2023-33034
CERT-FR advisories
- CERTFR-2023-AVI-0811 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:csra6620_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:csra6640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3991_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3998_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6750_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn685x-5_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn685x-1_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:flight_rb5_5g_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qam8295p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6595_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcn9011_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcn9012_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qrb5165m_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qrb5165n_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:video_collaboration_vc1_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:robotics_rb5_platform_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa4150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa4155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8295p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd888_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7315_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7325p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq5053-aa_firmware:-:*:*:*:*:*:*:*- +24 more
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon | affected CSRA6620 ; affected CSRA6640 ; affected FastConnect 6200 ; affected FastConnect 6700 ; affected FastConnect 6900 ; affected Flight RB5 5G Platform |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |