Buffer Copy Without Checking Size of Input in Data Modem (Qualcomm, Inc. Snapdragon)
At a glance
- Source
- NVD
- EPSS
- EPSS 0.44 % · percentile 38 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Analyzed
Description
Memory corruption in Data Modem while verifying hello-verify message during the DTLS handshake.
Weaknesses (CWE)
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.1 | CRITICAL 9.8 | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | qualcomm |
| CVSS 3.1 | CRITICAL 9.8 | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | NVD · product-security@qualcomm.com (Secondary) |
European references
- ENISA EUVD · EUVD-2023-32252
- GCVE · GCVE-0-2023-28582
CERT-FR advisories
- CERTFR-2024-AVI-0272 — Multiples vulnérabilités dans Google Android et Pixel · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6584au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcc710_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm4490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm8550_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcn6024_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcn6224_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcn6274_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcn9024_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs4490_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qfw7114_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qfw7124_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8550p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_4_gen_2_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_8_gen_2_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_8_gen_3_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_8\+_gen_2_mobile_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_auto_5g_modem-rf_gen_2_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_x65_5g_modem-rf_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_x70_modem-rf_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_x75_5g_modem-rf_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9340_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9390_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9395_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8832_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*- +3 more
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon | affected AR8035 ; affected FastConnect 6700 ; affected FastConnect 6900 ; affected FastConnect 7800 ; affected QCA6584AU ; affected QCA6698AQ |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |