Use After Free in Audio (Qualcomm, Inc. Snapdragon)
En bref
- Source
- NVD
- EPSS
- EPSS 0.12 % · centile 2 ()
- État
- PUBLISHED
- Publiée
- Mise à jour
- Attribuée par
- qualcomm
- Statut NVD
- Modified
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Description
Memory corruption in Audio while running concurrent tunnel playback or during concurrent audio tunnel recording sessions.
Faiblesses (CWE)
- CWE-416 — Utilisation après libération
Références
Scores
| Version | Score | Vecteur | Évalué par |
|---|---|---|---|
| CVSS 3.1 | HIGH 8.4 | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | qualcomm |
| CVSS 3.1 | HIGH 8.4 | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | NVD · product-security@qualcomm.com (Secondary) |
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
Références européennes
- ENISA EUVD · EUVD-2023-25839
- GCVE · GCVE-0-2023-21672
Avis du CERT-FR
- CERTFR-2023-AVI-0516 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Configurations affectées (CPE NVD)
cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qam8255p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qam8295p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qam8650p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qam8775p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6595_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6797aq_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm4325_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa4150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa4155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8255p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8295p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sg4150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_4_gen_2_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_680_4g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_685_4g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_8_gen_1_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_8\+_gen_1_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_ar2_gen_1_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_w5\+_gen_1_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_xr2_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:ssg2115p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:ssg2125p_firmware:-:*:*:*:*:*:*:*- +17 autres
Produits affectés
| Produit | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon | affected FastConnect 6700 ; affected FastConnect 6900 ; affected FastConnect 7800 ; affected QAM8255P ; affected QAM8295P ; affected QAM8650P |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |