Information Exposure in DSP Services (Qualcomm, Inc. Snapdragon)
At a glance
- Source
- NVD
- EPSS
- EPSS 0.11 % · percentile 1 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
Information disclosure in DSP Services while loading dynamic module.
Weaknesses (CWE)
- CWE-200 — Exposure of Sensitive Information to an Unauthorized Actor
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.1 | MEDIUM 6.2 | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N | qualcomm |
| CVSS 3.1 | MEDIUM 6.2 | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N | NVD · product-security@qualcomm.com (Secondary) |
| CVSS 3.1 | MEDIUM 5.5 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2023-25791
- GCVE · GCVE-0-2023-21624
CERT-FR advisories
- CERTFR-2023-AVI-0516 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6800_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qam8255p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6310_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6320_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6797aq_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs8155_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6155_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8155_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8255p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd835_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd888_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7315_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7325p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_778g_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_778g\+_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_780g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_782g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_7c\+_gen_3_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_835_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_865_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_865\+_firmware:-:*:*:*:*:*:*:*- +27 more
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon | affected FastConnect 6700 ; affected FastConnect 6800 ; affected FastConnect 6900 ; affected QAM8255P ; affected QCA6310 ; affected QCA6320 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |