Qualcomm, Inc. Snapdragon Mobile, Snapdragon Wearables

CVE-2022-25698
HIGH 8.4

At a glance

Source
NVD
EPSS
EPSS 0.13 % · percentile 2 ()
State
PUBLISHED
Published
Updated
Assigner
qualcomm
NVD status
Modified

Description

Memory corruption in SPI buses due to improper input validation while reading address configuration from spi buses in Snapdragon Mobile, Snapdragon Wearables

Weaknesses (CWE)

References

Scores

VersionScoreVectorScored by
CVSS 3.1HIGH 8.4CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:Hqualcomm
CVSS 3.1HIGH 8.4CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:HNVD · product-security@qualcomm.com (Secondary)
CVSS 3.1HIGH 7.8CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:HNVD · nvd@nist.gov (Primary)

European references

CERT-FR advisories

Affected configurations (NVD CPE)

Affected products

ProductVersions
Qualcomm, Inc. · Snapdragon Mobile, Snapdragon Wearablesaffected SD 8 Gen1 5G ; affected SD429 ; affected SDA429W ; affected SDM429W ; affected WCD9380 ; affected WCN3610

Sources

SourceLicence
CVE List (CVEProject cvelistV5)CVE Program Terms of Use
EPSS (FIRST.org)FIRST — attribution requested
ENISA EUVDENISA — reproduction authorised, source acknowledged
CERT-FR (ANSSI)Licence Ouverte / Etalab 2.0
NVD (NIST) via fkie-cad/nvd-json-data-feedsPublic domain — this product uses data from the NVD API but is not endorsed or certified by the NVD