Qualcomm, Inc. Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables
At a glance
- Source
- NVD
- EPSS
- EPSS 0.12 % · percentile 2 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
Memory corruption in audio module due to integer overflow in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables
Weaknesses (CWE)
- CWE-190 — Integer Overflow or Wraparound
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.1 | HIGH 8.4 | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | qualcomm |
| CVSS 3.1 | HIGH 8.4 | CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | NVD · product-security@qualcomm.com (Secondary) |
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2022-27235
- GCVE · GCVE-0-2022-22081
CERT-FR advisories
- CERTFR-2022-AVI-799 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd888_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx65_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7450_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8475_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8475p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sw5100_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sw5100p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6750_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6850_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6851_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6855_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6856_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn7851_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8832_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables | affected AR8035, QCA6595AU, QCA8081, QCA8337, SA6155P, SA8155P, SA8195P, SD 8 Gen1 5G, SD888 5G, SDX65, SM7450, SM8475, SM8475P, SW5100, SW5100P, WCD9370, WCD9375, WCD9380, WCD9385, WCN3980, WCN3988, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WCN7851, WSA8830, WSA8832, WSA8835 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |