Qualcomm, Inc. Snapdragon Connectivity, Snapdragon Mobile
En bref
- Source
- NVD
- EPSS
- EPSS 0.46 % · centile 40 ()
- État
- PUBLISHED
- Publiée
- Mise à jour
- Attribuée par
- qualcomm
- Statut NVD
- Modified
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Description
Improper validation of tag id while RRC sending tag id to MAC can lead to TOCTOU race condition in Snapdragon Connectivity, Snapdragon Mobile
Faiblesses (CWE)
Références
Scores
| Version | Score | Vecteur | Évalué par |
|---|---|---|---|
| CVSS 3.1 | HIGH 7.5 | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H | qualcomm |
| CVSS 3.1 | HIGH 7.5 | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H | NVD · product-security@qualcomm.com (Secondary) |
| CVSS 3.1 | MEDIUM 5.9 | CVSS:3.1/AV:N/AC:H/PR:N/UI:N/S:U/C:N/I:N/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 7.1 | AV:N/AC:M/Au:N/C:N/I:N/A:C | NVD · nvd@nist.gov (Primary) |
Références européennes
- ENISA EUVD · EUVD-2021-21755
- GCVE · GCVE-0-2021-35111
Avis du CERT-FR
- CERTFR-2022-AVI-524 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Configurations affectées (CPE NVD)
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd765_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd765g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd768g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd778g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd870_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd888_5g_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx65_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7250p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7450_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8475_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8475p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3991_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn3998_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6750_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6850_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6851_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6855_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn6856_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wcn7851_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8832_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
Produits affectés
| Produit | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Connectivity, Snapdragon Mobile | affected AR8035, QCA6390, QCA6391, QCA8081, QCA8337, SD 8 Gen1 5G, SD765, SD765G, SD768G, SD778G, SD865 5G, SD870, SD888 5G, SDX55, SDX55M, SDX65, SM7250P, SM7450, SM8475, SM8475P, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3991, WCN3998, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WCN7851, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |