Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
En bref
- Source
- NVD
- EPSS
- EPSS 0.71 % · centile 53 ()
- État
- PUBLISHED
- Publiée
- Mise à jour
- Attribuée par
- qualcomm
- Statut NVD
- Modified
Description
Possible buffer overflow while copying the frame to local buffer due to lack of check of length before copying in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8076, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCA6174A, QCA6574AU, QCA6584AU, QCA9377, QCA9379, QCA9886, QCM2150, QCS405, QCS605, QM215, Rennell, SC7180, SC8180X, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SM6150, SM7150, SM8150, SXR1130
Faiblesses (CWE)
- CWE-120 — Copie de tampon sans vérification de taille (débordement classique)
Références
Scores
| Version | Score | Vecteur | Évalué par |
|---|---|---|---|
| CVSS 3.1 | CRITICAL 9.8 | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 7.5 | AV:N/AC:L/Au:N/C:P/I:P/A:P | NVD · nvd@nist.gov (Primary) |
Références européennes
- ENISA EUVD · EUVD-2020-24885
- GCVE · GCVE-0-2020-3614
Avis du CERT-FR
- CERTFR-2020-AVI-331 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Configurations affectées (CPE NVD)
cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8017_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8076_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8096_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8098_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:ipq6018_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9207c_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8905_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8909_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8917_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8920_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8937_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8940_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8953_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8998_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:nicobar_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6584au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca9377_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca9379_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca9886_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm2150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qm215_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:rennell_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sc7180_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm429w_firmware:-:*:*:*:*:*:*:*- +15 autres
Produits affectés
| Produit | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | affected APQ8009, APQ8017, APQ8053, APQ8076, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCA6174A, QCA6574AU, QCA6584AU, QCA9377, QCA9379, QCA9886, QCM2150, QCS405, QCS605, QM215, Rennell, SC7180, SC8180X, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SM6150, SM7150, SM8150, SXR1130 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |