Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
En bref
- Source
- NVD
- EPSS
- EPSS 1.54 % · centile 75 ()
- État
- PUBLISHED
- Publiée
- Mise à jour
- Attribuée par
- qualcomm
- Statut NVD
- Modified
Rechercher sur…
Description
Buffer overflow/underflow occurs when typecasting the buffer passed by CPU internally in the library which is not aligned with the actual size of the structure' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA845, SDM640, SDM670, SDM710, SDM830, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM8150, SM8150P
Faiblesses (CWE)
- CWE-787 — Écriture hors limites
Références
Scores
| Version | Score | Vecteur | Évalué par |
|---|---|---|---|
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 7.2 | AV:L/AC:L/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
Références européennes
- ENISA EUVD · EUVD-2020-3556
- GCVE · GCVE-0-2020-11202
Configurations affectées (CPE NVD)
cpe:2.3:o:qualcomm:qcm6125_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs603_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs6125_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6155_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8155_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda670_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm830_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx50m_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6125_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6250_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6250p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7125_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8150p_firmware:-:*:*:*:*:*:*:*
Produits affectés
| Produit | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | affected QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA845, SDM640, SDM670, SDM710, SDM830, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM8150, SM8150P |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |