Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
At a glance
- Source
- NVD
- EPSS
- EPSS 0.90 % · percentile 60 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
Buffer overflow can occur in function wlan firmware while copying association frame content if frame length is more than the maximum buffer size in case of SAP mode in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA4531, QCA6174A, QCA6564, QCA6574AU, QCA6584, QCA6584AU, QCA8081, QCA9377, QCA9379, QCA9886, QCN7605, QCS404, QCS405, QCS605, Rennell, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SM6150, SM7150, SM8150, SXR1130, SXR2130
Weaknesses (CWE)
- CWE-120 — Buffer Copy without Checking Size of Input
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.1 | CRITICAL 9.8 | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 10.0 | AV:N/AC:L/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2019-5363
- GCVE · GCVE-0-2019-14110
CERT-FR advisories
- CERTFR-2020-AVI-190 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8017_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8064_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8096_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8098_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:ipq6018_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9207c_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8996_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8998_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:nicobar_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca4531_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6564_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6584_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6584au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca9377_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca9379_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca9886_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcn7605_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs404_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:rennell_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sc7180_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*- +12 more
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | affected APQ8009, APQ8017, APQ8053, APQ8064, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA4531, QCA6174A, QCA6564, QCA6574AU, QCA6584, QCA6584AU, QCA8081, QCA9377, QCA9379, QCA9886, QCN7605, QCS404, QCS405, QCS605, Rennell, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SM6150, SM7150, SM8150, SXR1130, SXR2130 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |