Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
At a glance
- Source
- NVD
- EPSS
- EPSS 0.90 % · percentile 60 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
UTCB object has a function pointer called by the reaper to deallocate its memory resources and this address can potentially be corrupted by stack overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Weaknesses (CWE)
- CWE-787 — Out-of-bounds Write
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.1 | CRITICAL 9.8 | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 10.0 | AV:N/AC:L/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2019-2416
- GCVE · GCVE-0-2019-10612
CERT-FR advisories
- CERTFR-2020-AVI-121 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm850_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8250_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | affected MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |