Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
At a glance
- Source
- NVD
- EPSS
- EPSS 1.59 % · percentile 76 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
Lack of boundary checks for data offsets received from HLOS can lead to out-of-bound read in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8016, APQ8017, APQ8053, APQ8076, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9205, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, QCM2150, QCS605, QM215, Rennell, SC7180, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SXR1130, SXR2130
Weaknesses (CWE)
- CWE-125 — Out-of-bounds Read
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.1 | HIGH 7.1 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | LOW 3.6 | AV:L/AC:L/Au:N/C:P/I:N/A:P | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2019-2378
- GCVE · GCVE-0-2019-10574
CERT-FR advisories
- CERTFR-2020-AVI-190 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8016_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8017_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8076_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8096_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8098_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9207c_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8905_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8909_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8917_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8920_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8937_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8940_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8953_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8996_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8998_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm2150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qm215_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:rennell_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sc7180_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm429w_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm450_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*- +11 more
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | affected APQ8009, APQ8016, APQ8017, APQ8053, APQ8076, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9205, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, QCM2150, QCS605, QM215, Rennell, SC7180, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SXR1130, SXR2130 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |