Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
At a glance
- Source
- NVD
- EPSS
- EPSS 0.88 % · percentile 59 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
Multiple Buffer Over-read issue can happen due to improper length checks while decoding Service Reject/RAU Reject/PTMSI Realloc cmd in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9205, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130
Weaknesses (CWE)
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.1 | CRITICAL 9.1 | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 9.4 | AV:N/AC:L/Au:N/C:C/I:N/A:C | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2019-2356
- GCVE · GCVE-0-2019-10552
CERT-FR advisories
- CERTFR-2020-AVI-121 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8017_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8096_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8098_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9615_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9625_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8905_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8909_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8917_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8920_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8937_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8939_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8940_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8953_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8998_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:nicobar_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcm2150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qm215_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:rennell_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm429w_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm450_firmware:-:*:*:*:*:*:*:*- +15 more
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | affected APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9205, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |