Qualcomm, Inc. Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
At a glance
- Source
- NVD
- EPSS
- EPSS 0.23 % · percentile 14 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605.
Weaknesses (CWE)
- CWE-119 — Improper Restriction of Operations within the Bounds of a Memory Buffer
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.0 | HIGH 7.8 | CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 7.2 | AV:L/AC:L/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2018-5822
- GCVE · GCVE-0-2018-13888
CERT-FR advisories
- CERTFR-2019-AVI-003 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:zz_qcs605_firmware:-:*:*:*:*:*:*:*
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | affected MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |