CVE-2018-11865
Qualcomm, Inc. Snapdragon Mobile, Snapdragon Wear
HIGH 7.8
At a glance
- Source
- NVD
- EPSS
- EPSS 0.23 % · percentile 14 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
Integer overflow may happen when calculating an internal structure size due to lack of validation of the input length in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016.
Weaknesses (CWE)
- CWE-190 — Integer Overflow or Wraparound
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.0 | HIGH 7.8 | CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 7.2 | AV:L/AC:L/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2018-3857
- GCVE · GCVE-0-2018-11865
CERT-FR advisories
- CERTFR-2018-AVI-421 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Mobile, Snapdragon Wear | affected MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |