Qualcomm, Inc. Snapdragon Mobile, Snapdragon Wear
At a glance
- Source
- NVD
- EPSS
- EPSS 0.24 % · percentile 15 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
Possible integer overflow may happen in WLAN during memory allocation in Snapdragon Mobile, Snapdragon Wear in version IPQ8074, MDM9206, MDM9607, MDM9650, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 835, SD 845, SD 850, SDA660, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016
Weaknesses (CWE)
- CWE-190 — Integer Overflow or Wraparound
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.0 | HIGH 7.8 | CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 7.2 | AV:L/AC:L/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2018-3813
- GCVE · GCVE-0-2018-11821
CERT-FR advisories
- CERTFR-2019-AVI-142 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Mobile, Snapdragon Wear | affected IPQ8074, MDM9206, MDM9607, MDM9650, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 835, SD 845, SD 850, SDA660, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |