CVE-2018-11288
Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
HIGH 7.8
At a glance
- Source
- NVD
- EPSS
- EPSS 0.23 % · percentile 14 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
Possible undefined behavior due to lack of size check in function for parameter segment_idx can lead to a read outside of the intended region in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDX24, SXR1130
Weaknesses (CWE)
- CWE-129 — Improper Validation of Array Index
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.0 | HIGH 7.8 | CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 7.2 | AV:L/AC:L/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2018-3328
- GCVE · GCVE-0-2018-11288
CERT-FR advisories
- CERTFR-2018-AVI-421 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear | affected MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDX24, SXR1130 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |