Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
At a glance
- Source
- NVD
- EPSS
- EPSS 0.17 % · percentile 6 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Weaknesses (CWE)
- CWE-732 — Incorrect Permission Assignment for Critical Resource
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.0 | HIGH 7.8 | CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | MEDIUM 4.6 | AV:L/AC:L/Au:N/C:P/I:P/A:P | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2018-3317
- GCVE · GCVE-0-2018-11277
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd210_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd212_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd430_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd450_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd615_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd616_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd415_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd617_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd625_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd652_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd810_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd820_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd820a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd835_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear | affected MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |