CVE-2018-11269
Qualcomm, Inc. SSnapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
HIGH 7.8
At a glance
- Source
- NVD
- EPSS
- EPSS 0.27 % · percentile 19 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.
Weaknesses (CWE)
- CWE-129 — Improper Validation of Array Index
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.0 | HIGH 7.8 | CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 7.2 | AV:L/AC:L/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2018-3309
- GCVE · GCVE-0-2018-11269
CERT-FR advisories
- CERTFR-2018-AVI-530 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd210_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd212_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd425_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd427_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd430_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd435_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd450_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd625_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd652_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd810_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd820_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd820a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd835_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd850_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · SSnapdragon Automobile, Snapdragon Mobile, Snapdragon Wear | affected MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |