CVE-2017-18314
Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
CRITICAL 9.8
En bref
- Source
- NVD
- EPSS
- EPSS 0.94 % · centile 61 ()
- État
- PUBLISHED
- Publiée
- Mise à jour
- Attribuée par
- qualcomm
- Statut NVD
- Modified
Description
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ.
Références
Scores
| Version | Score | Vecteur | Évalué par |
|---|---|---|---|
| CVSS 3.0 | CRITICAL 9.8 | CVSS:3.0/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 10.0 | AV:N/AC:L/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
Références européennes
- ENISA EUVD · EUVD-2017-9440
- GCVE · GCVE-0-2017-18314
Avis du CERT-FR
- CERTFR-2018-AVI-421 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Configurations affectées (CPE NVD)
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd210_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd212_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd410_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd412_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd425_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd427_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd430_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd435_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd450_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd615_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd616_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd415_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd617_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd625_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd652_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd810_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd820_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd820a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd835_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
Produits affectés
| Produit | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear | affected FSM9055, FSM9955, MDM9607, MDM9640, MDM9650, MSM8909W, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |