Qualcomm, Inc. Snapdragon Mobile, Snapdragon Wear
At a glance
- Source
- NVD
- EPSS
- EPSS 0.24 % · percentile 15 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835.
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.0 | HIGH 7.0 | CVSS:3.0/AV:L/AC:H/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | MEDIUM 6.9 | AV:L/AC:M/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2017-9431
- GCVE · GCVE-0-2017-18305
CERT-FR advisories
- CERTFR-2018-AVI-372 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Mobile, Snapdragon Wear | affected MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |